Posted inSectors

STMicroelectronics’s groundbreaking toolchain and software package will revolutionizing the industry

The toolchain and software are expected to ease the development of edge processing with intelligent inertial sensors.

The new toolchain and accompanying software package from STMicroelectronics helps in programming the intelligent sensor processing unit (ISPU) embedded in the latest-generation intelligent MEMS IMUs, ISM330IS and LSM6DSO16IS.

The toolchain and software are expected to ease the development of edge processing with intelligent inertial sensors. It will help employ the ISPU to handle motion-related workloads such as activity recognition and anomaly detection directly in the sensor.

With the help of the ISPU toolchain, the developers will be able to program the sensor’s intelligent processing unit using the familiar and widespread C programming language. They can choose to work from a command line interface (CLI) or an Eclipse-based environment like STM32CubeIDE. They can also decide to deploy a graphical user interface (GUI) such as AlgoBuilder and Unicleo.

The X-CUBE-ISPU software package contains templates and example projects as well as ready-to-use libraries. These can help developers to quickly understand how to use and program the sensors’ ISPU and can be used as a starting point to implement custom algorithms. Pre-built files are also available. These allow the users to load the X-CUBE-ISPU examples directly into the sensor using one of the GUIs without any coding.

These resources help in the effective development of applications such as personal electronics including wearable devices for activity recognition and health monitoring, as well as industrial devices such as asset trackers, equipment-condition monitors, robots, and machine controllers.

ST’s ISM330IS and LSM6DSO16IS inertial modules contain an always-on 3D accelerometer and 3D gyroscope with the embedded ISPU. With the help of Sensor hub functionality, they are able to collect data from up to four additional external sensors. An embedded temperature sensor is also included, and each device is housed in a compact 2.5mm x 3mm x 0.83mm plastic land grid array (LGA) package.